We maintain state-of-the-art facilities and equipment to supply the following technologies:

• SMT assembly
• THT assembly
• N2-Convection reflow
• Vapour phase reflow
• N2-Selective soldering
• Conformal coating for printed circuits
• Macromelt® Moulding

Our most modern and fully automatic SMD assembling lines are equipped with various assembling machines such as Siemens Siplace HS50 F5, Mydata My 15 and My 12.

These machines represent the latest technology and guarantee you a fast and precise production of your SMD assemblies.

manufacturing capacity SMT assembly: Maximum output 500 million assemblies p.a. Minimum assembly dimensions Type 0201 Maximum assembly dimensions 70 mm x 30 mm Fine pitch placement To 0.3 mm Heat sink circuit boards   Circuit board dimensions maximum 368 mm x 400 mm Types:   BGA   CSP   m-BGA   Flip-Chip   Reflow:   Vapour phase reflow   Convection reflow   IR reflow   All fully automated reflow processes performed in a controlled nitrogen atmosphere (protective gas).